Measurement of thermophysical properties of particulate-filled polymer composites

High Temperatures - High Pressures

Volumn 37, Issue 1, 2008, Pages 21-30

  Kim, Sok Won ^a   Choi, Byeongmin ^a   Lee, Sang Hyun ^b   Kang, Kweon Ho ^c  

^a University of Ulsan   (South Korea)

^b Korea Research Institute of Standards and Science   (South Korea)

^c Korea Atomic Energy Research Institute   (South Korea)

Author keywords

Coefficient of thermal expansion; Differential scanning calorimeter; IC packaging materials; Laser flash; Particulate filled polymer composites; Thermal conductivity; Thermo mechanical analyzer

Indexed keywords

EID: 77949442105     PISSN: 00181544     EISSN: 14723441     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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