Fabrication of sub-10 nm planar nanofluidic channels through native oxide etch and anodic wafer bonding

IEEE Transactions on Nanotechnology

Volumn 9, Issue 2, 2010, Pages 138-141

  Song, Chunrong ^a   Wang, Pingshan ^a  

^a AMRL   (United States)

Author keywords

Etching; Nanofabrication; Nanofluidic channel; Wafer bonding

Indexed keywords

ANODIC BONDING; ETCH RATES; LOW TEMPERATURES; LOW-VOLTAGE; NANO CHANNELS; NANOFABRICATION; NANOFLUIDIC CHANNEL; NATIVE OXIDES; PROCESS YIELD; ROOM TEMPERATURE; SILICON DIOXIDE; SILICON TRENCH;

ASPECT RATIO; ETCHING; NANOFLUIDICS; SILICON COMPOUNDS; SILICON OXIDES; SILICON WAFERS;

WAFER BONDING;

EID: 77949342465     PISSN: 1536125X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNANO.2009.2038377     Document Type: Article

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