Development of highly thermoconductive epoxy composites

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

Volumn , Issue , 2009, Pages 638-641

  Miyazaki, Yasuo ^a   Nishiyama, Tomoo ^a   Takahashi, Hiroyuki ^a   Katagiri, Jun Ichi ^b   Takezawa, Yoshitaka ^a  

^a High Performance Materials Department   (Japan)

^b HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC FILLERS; CRYSTALLINITIES; ELECTRICAL INSULATION; EPOXY COMPOSITE; EPOXY MONOMERS; EPOXY RESIN COMPOSITES; HIGH-ORDER STRUCTURE; MESOGENES; MOLECULAR ARCHITECTURE; STRUCTURE DOMAINS; THERMOSETTING RESINS; VARNISH COATING;

CARBON FIBER REINFORCED PLASTICS; MOLDING; MONOMERS; RESIN TRANSFER MOLDING; RESINS; THERMAL CONDUCTIVITY; THERMAL INSULATION; THERMOANALYSIS; THERMOSETS;

EPOXY RESINS;

EID: 77949311311     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CEIDP.2009.5377902     Document Type: Conference Paper

References (7)

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