Electrodeposited amorphous Co-P based alloy with improved thermal stability

Journal of Magnetism and Magnetic Materials

Volumn 322, Issue 9-12, 2010, Pages 1536-1539

  McCloskey, Paul ^a   Jamieson, Brice ^a   O'Donnell, Terence ^a   Gardner, Donald ^b   Morris, Michael A ^c   Roy, Saibal ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b INTEL CORPORATION   (United States)

^c UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

Co P; High frequency soft magnetic material; Integrated inductor; Multi nano layer; Thermal stability

Indexed keywords

A-THERMAL; COERCIVITIES; HIGH RESISTIVITY; HIGH-FREQUENCY SOFT MAGNETIC MATERIAL; INTEGRATED INDUCTORS; MAGNETIC ALLOY; MAGNETISATION; ONCHIP INDUCTORS; SILICON PROCESS TECHNOLOGY; THERMAL PERFORMANCE; THERMAL STABILITY;

ALLOYS; CORROSION; ELECTRIC INDUCTORS; ELECTRODEPOSITION; MAGNETIC DEVICES; MAGNETIC MATERIALS; MAGNETIC PROPERTIES; SATURATION MAGNETIZATION; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS;

AMORPHOUS SILICON;

EID: 77949300161     PISSN: 03048853     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmmm.2009.07.059     Document Type: Article

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