Dielectric characterization of high density polyethylene/SiO2 nanocomposites

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

Volumn , Issue , 2009, Pages 689-692

  Sami, A ^a   David, E ^a   Frechette M ^b  

^a ÉCOLE DE TECHNOLOGIE SUPÉRIEURE   (Canada)

^b HYDRO QUÉBEC   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC BREAKDOWN STRENGTH; DIELECTRIC CHARACTERIZATION; HDPE COMPOSITE; HIGH DENSITY; MELT-COMPOUNDING; NANOSCALE STRUCTURE; SCANNING AND TRANSMISSION ELECTRON MICROSCOPY; SEM AND TEM; STRESS TEST; THERMAL PROPERTIES; TWIN SCREW EXTRUDERS;

DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC BREAKDOWN; ELECTRIC PROPERTIES; NANOCOMPOSITES; THERMODYNAMIC PROPERTIES; TRANSMISSION ELECTRON MICROSCOPY;

SCANNING ELECTRON MICROSCOPY;

EID: 77949297979     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CEIDP.2009.5377742     Document Type: Conference Paper

References (6)

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3. Xu, J. T.; Liang, G. D.; Fan, Z. Q. "Electrical properties of low density polyethylene/ZnO nanocomposites: The effect of thermal treatments ". Polymer, 45, 6675. 2004
4. IEEE Std-930-2004
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6. Lewis T J. "Interfaces and nanodielectries". Int. Conf. on Solid Dielectrics pp 792-795 Vol.2 2004