Interfacial reactions, microstructure, and strength of Sn-8Zn-3Bi and Sn-9Zn-Al solder on Cu and Au/Ni (P) pads

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 41, Issue 2, 2010, Pages 275-284

  Hsi, Chi Shiung ^a   Lin, Ching Tsung ^a,b   Chang, Tao Chih ^b   Wang, Moo Chin ^c   Liang, Ming Kann ^b  

^a NATIONAL UNITED UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c KAOHSIUNG MEDICAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; ELECTROLESS NI; IMC LAYER; INTERFACIAL MICROSTRUCTURE; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; ORGANIC SOLDERABILITY PRESERVATIVE; P-LAYER; PASSIVE COMPONENTS; PB FREE SOLDERS; REFLOW--SOLDERING; SN-8ZN-3BI; SOLDER JOINTS; ZINC ATOMS;

ALUMINUM; FLIP CHIP DEVICES; LEAD; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SOLDERING; SOLDERING ALLOYS; ZINC; ZINC ALLOYS;

TIN;

EID: 77949266514     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-009-0109-6     Document Type: Article

References (35)

1. J.W. Yoon S.B. Jung 2006 J. Alloys Compd. 407 141 49 10.1016/j.jallcom. 2005.06.047 1:CAS:528:DC%2BD2MXhtlCrsrbN
2. F. Guo S. Choi J.P. Lucas K.N. Subramanian 2000 J. Electron. Mater. 29 1241 48 10.1007/s11664-000-0019-2 1:CAS:528:DC%2BD3cXnsFOqtrY%3D 2000JEMat..29.1241G
3. M. McCormack S. Jin G.W. Kammlott H.S. Chen 1993 Appl. Phys. Lett. 63 15 17 10.1063/1.109734 1:CAS:528:DyaK3sXlsVCgt7s%3D 1993ApPhL..63...15M
4. S.W. Kim J.W. Yoon S.B. Jung 2004 J. Electron. Mater. 33 1182 89 10.1007/s11664-004-0121-y 1:CAS:528:DC%2BD2cXosVymsLo%3D 2004JEMat..33.1182K
5. P.C. Shih K.L. Lin 2006 J. Alloys Compd. 422 153 63 10.1016/j.jallcom. 2005.11.081 1:CAS:528:DC%2BD28XoslCmurk%3D (Pubitemid 44278561)
6. K.I. Chen S.C. Cheng S. Wu K.L. Lin 2006 J. Alloys Compd. 416 98 105 10.1016/j.jallcom.2005.08.034 1:CAS:528:DC%2BD28XkvF2gtL4%3D
7. Y.S. Kim K.S. Kim C.W. Hwang K. Suganuma 2003 J. Alloys Compd. 352 237 45 10.1016/S0925-8388(02)01168-4 1:CAS:528:DC%2BD3sXitlerurc%3D
8. K.S. Kim J.M. Yang C.H. Yu I.O. Jung H.H. Kim 2004 J. Alloys Compd. 379 314 18 10.1016/j.jallcom.2004.03.138 1:CAS:528:DC%2BD2cXntlSksLY%3D
9. Y.C. Liu W.H. Lin H.J. Lin T.H. Chuang 2006 J. Electron. Mater. 35 147 53 10.1007/s11664-006-0197-7 2006JEMat..35..147L
10. K.L. Lin L.H. Wen T.P. Liu 1998 J. Electron. Mater. 27 97 105 1054.54507 10.1007/s11664-998-0197-x 1:CAS:528:DyaK1cXhslSmtLc%3D 1998JEMat..27...97L
11. K.L. Lin Y.C. Wang 1998 J. Electron. Mater. 27 1205 10 10.1007/s11664-998-0070-y 1:CAS:528:DyaK1cXntlKiu7g%3D 1998JEMat..27.1205L
12. C.W. Huang K.L. Lin 2004 J. Mater. Res. 19 3560 68 10.1557/JMR.2004.0458 1:CAS:528:DC%2BD2cXhtVOlsLvN 2004JMatR..19.3560H (Pubitemid 40168195)
13. S.C. Chang S.C. Lin K.C. Hsieh 2006 J. Electron. Mater. 35 399 405 10.1007/BF02690525 1:CAS:528:DC%2BD28Xjt1Skur0%3D 2006JEMat..35..399C
14. K. Zeng K.N. Tu 2002 Mater. Sci. Eng. R38 55 105 1:CAS:528: DC%2BD38XjvFOntLs%3D
15. K.M. Kumar V. Kripesh L. Shen K. Zeng A.A.O. Tay 2006 Mater. Sci. Eng. A423 57 63 1:CAS:528:DC%2BD28XksVOgtbo%3D
16. M. Date K.N. Tu 2004 J. Mater. Res. 19 2887 96 10.1557/JMR.2004.0371 1:CAS:528:DC%2BD2cXotl2is74%3D 2004JMatR..19.2887D
17. A. Bansal, S. Yoon, and V. Mahadev: SMTA Pan Pacific Microelectron. Symp., Kauai, Hawaii, SMTA, Edina, MN, 2005, pp. 1-8.
18. R. Prasad 2001 SMT Mag. 15 5 87
19. R.J.K. Wassink: Soldering in Electronics, 2nd ed., Electrochemical Publications Ltd., GB-Port Erin, British Isles, 1989, 302 pp.
20. S.C. Chang S.C. Lin K.C. Hsieh 2007 J. Alloys Compd. 428 179 84 10.1016/j.jallcom.2006.01.106 1:CAS:528:DC%2BD2sXmvFel (Pubitemid 44969537)
21. J.W. Yoon S.B. Jung 2006 J. Mater. Res. 21 1590 99 10.1557/jmr.2006.0198 1:CAS:528:DC%2BD28XlsFWksrk%3D 2006JMatR..21.1590Y (Pubitemid 44063725)
22. M. Date K.N. Tu T. Shoji M. Fujiyoshi K. Sato 2004 Scripta Mater. 51 641 45 10.1016/j.scriptamat.2004.06.027 1:CAS:528:DC%2BD2cXlvFals7w%3D
23. C.T. Lin C.S. Hsi M.C. Wang T.C. Chang M.K. Liang 2008 J. Alloys Compd. 459 225 31 10.1016/j.jallcom.2007.05.029 1:CAS:528:DC%2BD1cXmt1OhsLc%3D (Pubitemid 351680633)
24. H.S. Liu K. Ishida Z.P. Jin Y. Du 2003 Intermetallics 11 987 94 10.1016/S0966-9795(03)00115-8 1:CAS:528:DC%2BD3sXptVyhsLs%3D
25. W.K. Liou Y.W. Yen 2009 Intermetallics 17 72 78 10.1016/j.intermet.2008. 10.001 1:CAS:528:DC%2BD1cXhsVenurjF
26. R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleiser, and K.K. Kelley: Selected Values of the Thermodynamic Properties of Binary Alloys, ASM, Metals Park, OH, 1973, pp. 810-20.
27. R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleiser, and K.K. Kelley: Selected Values of the Thermodynamic Properties of Binary Alloys, ASM, Metals Park, OH, 1973, pp. 332-38.
28. R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleiser, and K.K. Kelley: Selected Values of the Thermodynamic Properties of Binary Alloys, ASM, Metals Park, OH, 1973, pp. 115-20.
29. Z. Mei A.J. Sunwoo J.W. Morris Jr. 1992 Metall. Mater. Trans. A 23A 857 64 1:CAS:528:DyaK38Xhslyqu70%3D 1992MTA....23..857M
30. M. Nishiura A. Nakayama S. Sakatani Y. Kohara K. Uenishi K.F. Kobayash 2002 Mater. Trans. 43 1802 07 10.2320/matertrans.43.1802 1:CAS:528: DC%2BD38Xnt1ehurg%3D
31. Y. Chonan T. Komiyama J. Onuki R. Urao T. Kimura T. Nagano 2000 Mater. Trans. 43 1887 90 10.2320/matertrans.43.1887
32. K. Suganuma K. Niihara 1998 J. Mater. Res. 13 2859 65 10.1557/JMR.1998.0391 1:CAS:528:DyaK1cXms1aqs7w%3D 1998JMatR..13.2859S
33. J.H.L. Pang, T.I. Tan, and S.K. Sitaraman: IEEE 48th Electronic Components and Technology Conf., Seattle, WA, 1998, pp. 878-83.
34. J.H. Lau D.W. Rice C.G. Harkins 1990 IEEE Trans. Components, Hybrids Manuf. Technol. 13 182 87 10.1109/33.52868 (Pubitemid 20737450)
35. R.A. Islam B.Y. Wu M.O. Alam Y.C. Chan W. Jillek 2005 J. Alloys Compd. 392 149 58 10.1016/j.jallcom.2004.08.079 1:CAS:528:DC%2BD2MXjtlCrt74%3D (Pubitemid 40402888)