Fabrication of piezoelectric MEMS devices-from thin film to bulk PZT wafer

Journal of Electroceramics

Volumn 24, Issue 1, 2010, Pages 25-32

  Wang, Zhihong ^a   Miao, Jianmin ^a   Tan, Chee Wee ^a   Xu, Ting ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Composite thick film; Diaphragm type transducer; Micromachining; Piezoelectric Micro Electro Mechanical System (pMEMS); Sol gel thin film; Wafer bonding

Indexed keywords

COMPOSITE THICK FILM; COMPOSITE THICK FILMS; DEVICE APPLICATION; ELECTRODE PATTERN; IN-PLANE GEOMETRY; KEY TECHNIQUES; MICRO ELECTRO MECHANICAL SYSTEM; PIEZOELECTRIC LAYERS; PIEZOELECTRIC MEMS; PIEZOELECTRIC PROPERTY; PZT WAFER; SENSOR APPLICATIONS; SILICON SUBSTRATES; SOL-GEL THIN FILMS; WAFER BONDING TECHNIQUES;

BONDING; CERAMIC MATERIALS; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; COMPOSITE MICROMECHANICS; DIAPHRAGMS; GELS; MECHANICS; MECHATRONICS; MICROMACHINING; PIEZOELECTRICITY; REACTIVE ION ETCHING; SILICON WAFERS; SINGLE CRYSTALS; SOL-GEL PROCESS; SOL-GELS; SOLS; THICK FILMS; THIN FILM DEVICES; THIN FILMS; TRANSDUCERS; VAPOR DEPOSITION; WAFER BONDING; ZIRCONIUM;

THICK FILM DEVICES;

EID: 77649234584     PISSN: 13853449     EISSN: 15738663     Source Type: Journal    
DOI: 10.1007/s10832-008-9454-x     Document Type: Article

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