The microstructure, tensile properties, and creep behavior of AZ91, AS52 and TAS652 alloy

Journal of Alloys and Compounds

Volumn 493, Issue 1-2, 2010, Pages 502-506

  Kim, Byeong Ho ^a   Lee, Sang Won ^a   Park, Yong Ho ^a   Park, Ik Min ^a  

^a Pusan National University   (South Korea)

Author keywords

Creep properties; Mechanical properties; Microstructure; TAS652

Indexed keywords

AS CAST MICROSTRUCTURE; CREEP BEHAVIORS; CREEP PROPERTIES; DISLOCATION MOVEMENT; ELEVATED TEMPERATURE; ELEVATED TEMPERATURE STRENGTH; MATRIX; TENSILE TESTS; THERMALLY STABLE;

ALUMINUM; CERIUM ALLOYS; CREEP; MICROSTRUCTURE; SILICON; SILICON ALLOYS; TENSILE TESTING; TIN; TIN ALLOYS;

MECHANICAL PROPERTIES;

EID: 77249115172     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.12.145     Document Type: Article

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