Interfacial diffusion in Cu with a gradient nanostructured surface layer

Acta Materialia

Volumn 58, Issue 7, 2010, Pages 2376-2386

  Wang, Z B ^a   Lu, K ^a   Wilde, G ^b   Divinski, S V ^b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b UNIVERSITY OF MÜNSTER   (Germany)

Author keywords

Diffusion; Grain boundaries; Nanostructured material; Surface mechanical attrition treatment; Twin boundaries

Indexed keywords

DIFFUSION BEHAVIOR; DIFFUSION RATE; DIFFUSIVITIES; EFFECTIVE DIFFUSION; EFFECTIVE DIFFUSIVITIES; ENERGY STATE; EXCESS FREE ENERGY; GRADED MICROSTRUCTURES; HIGH ANGLE GRAIN BOUNDARIES; INTERFACIAL DIFFUSION; NANOSTRUCTURED SURFACE LAYER; ORDERS OF MAGNITUDE; RADIOTRACER TECHNIQUES; SUBSURFACE LAYER; SURFACE LAYERS; SURFACE MECHANICAL ATTRITION TREATMENTS; TWIN BOUNDARIES;

FREE ENERGY; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOSTRUCTURED MATERIALS; SURFACES;

DIFFUSION;

EID: 77249092594     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.12.024     Document Type: Article

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