Microstructure evolution and dielectric properties of plasma sprayed BaTiO3 coatings

Proceedings of the International Thermal Spray Conference

Volumn , Issue , 2009, Pages 547-550

  Kim, Young Mi ^a   Baik, Kyeong Ho ^a   Park, Kwang Seo ^b  

^a Chungnam National University   (South Korea)

^b Dansung Electron   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS COATING; AMORPHOUS PHASE; ATMOSPHERIC PLASMA SPRAYING; CRYSTALLINE PHASE; DIELECTRIC CONSTANTS; ELECTROSTATIC CHUCKS; EQUIAXED GRAIN STRUCTURE; HIGH DIELECTRIC CONSTANTS; HIGH TEMPERATURE HEAT TREATMENT; LOW TEMPERATURES; LOW-LEAKAGE CURRENT; MICROSTRUCTURAL FEATURES; MICROSTRUCTURE EVOLUTIONS; MOLTEN DROPLETS; PLASMA SPRAYED; SINTERING EFFECT; SPLAT QUENCHING;

BARIUM COMPOUNDS; CHUCKS; DROP FORMATION; ELECTROSTATIC COATINGS; LOW TEMPERATURE OPERATIONS; MICROELECTRONICS; MICROSTRUCTURAL EVOLUTION; PERMITTIVITY; PLASMA JETS; PLASMA SPRAYING; PROTECTIVE COATINGS; SINTERING;

SPRAYED COATINGS;

EID: 76749096382     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1361/cp2009itsc0547     Document Type: Conference Paper

References (2)

1. J.F. Deviet and L. Peccoud, Electrostatic Clamping Applied to Semiconductor Plasma Processing. I. Theoretical Modeling, 1993, J. Electrochem. Soc., 140(11), P3245-3256
2. 3, Materials Science of Engineering, 2001, B87, P23-30