Tensile creep of Mo-Si-B alloys

Acta Materialia

Volumn 58, Issue 6, 2010, Pages 2124-2142

  Jain, P ^a   Kumar, K S ^a  

^a Brown University   (United States)

Author keywords

Dislocations; High temperature deformation; Precipitation; Refractory metals; Segregation

Indexed keywords

APPLIED STRESS; CONSTANT LOADS; CONTROLLING MECHANISM; CREEP DATA; CREEP DEFORMATIONS; DISLOCATION CLIMB; DISLOCATIONS; ELEVATED TEMPERATURE; GRAIN BOUNDARY PRECIPITATION; HIGH TEMPERATURE DEFORMATION; INTERMETALLIC PHASIS; MO-SI-B ALLOYS; MULTI PHASE ALLOYS; NI-BASED SUPERALLOYS; PHASE ALLOYS; PRECIPITATION KINETICS; SINGLE PHASE; SOLID SOLUTION ALLOY; SOLID SOLUTION MATRICES; SOLID SOLUTION PHASE; STRESS EXPONENTS; TENSILE CREEP; TENSILE RESPONSE; TEST TEMPERATURES; TWO-PHASE ALLOYS; ULTRAHIGH TEMPERATURE; YIELD STRENGTH;

CERIUM ALLOYS; CREEP; CREEP RESISTANCE; CRYSTALLIZATION; DISSOLUTION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MOLYBDENUM; REFRACTORY MATERIALS; SEGREGATION (METALLOGRAPHY); SILICON; SILICON ALLOYS; SOLID SOLUTIONS; SOLIDIFICATION; STRAIN RATE; SUPERALLOYS; TERNARY ALLOYS;

MOLYBDENUM ALLOYS;

EID: 76249129848     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.11.054     Document Type: Article

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