Experimental and analytical investigations of the dynamic analysis of adhesively bonded joints or composite structures

Solid State Phenomena

Volumn 147-149, Issue , 2009, Pages 663-675

  Ghoneam, S M ^a   Hamada, A A ^a   EL Elamy, M I ^a  

^a Menoufia University   (Egypt)

Author keywords

Adhesive bonded joint; Composite structure ultrasonic test; Damping; Finite element

Indexed keywords

ADHESIVE JOINTS; BOUNDARY CONDITIONS; COMMUNICATION CHANNELS (INFORMATION THEORY); COMPOSITE MICROMECHANICS; CORROSION RESISTANCE; DAMPING; DYNAMIC ANALYSIS; FREQUENCY RESPONSE; HEAT RESISTANCE; MECHANICAL PROPERTIES; MECHATRONICS; STRUCTURE (COMPOSITION); TESTING; ULTRASONIC TESTING; ULTRASONIC WAVES; ULTRASONICS; ADHESIVES; FINITE ELEMENT METHOD; NONDESTRUCTIVE EXAMINATION;

ADHESIVE BONDED JOINTS; ADHESIVE-BONDED JOINT; ADHESIVELY BONDED JOINTS; ANALYTICAL INVESTIGATIONS; BOND LINE; BONDED JOINT; BONDED STRUCTURE; CODE NUMBERS; COMPOSITE ASSEMBLY; DAMPING CAPACITY; DYNAMIC BEHAVIORS; DYNAMIC PERFORMANCE; DYNAMIC PROPERTY; EXPERIMENTAL TEST; FINITE ELEMENT; FINITE ELEMENT MODELS; FREQUENCY RESPONSE FUNCTIONS; LINE CONFIGURATION; MATERIAL CHARACTERIZATIONS; NON-DESTRUCTIVE TECHNIQUE; NUMERICAL TECHNIQUES; OPERATING PROCESS; PULSE ECHOES; SOUND ISOLATION; STRUCTURAL BEAMS; TEST SPECIMENS; THERMAL RESIDUAL STRESS; ULTRASONIC TECHNIQUES; ULTRASONIC TEST;

FINITE ELEMENT METHOD; ADHESIVE JOINTS;

EID: 75849127186     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.147-149.663     Document Type: Conference Paper

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