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Advanced Materials Research

Volumn 89-91, Issue , 2010, Pages 503-508

In-situ X-ray diffraction investigations during diffusion anneals of Ni-Cu thin film diffusion couples

(3) Sheng, J a Welzel, U a Mittemeijer, E J a

a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS (Germany)

Author keywords

Diffusion; Metal thin films; Residual stress; X ray diffraction

Indexed keywords

BI-LAYER; BILAYER SYSTEMS; COEFFICIENTS OF THERMAL EXPANSIONS; CU THIN FILM; DIFFUSION ANNEALING; DIFFUSION COUPLE; EX SITU; IDENTICAL CONDITIONS; IN-SITU X-RAY DIFFRACTION; LOW HOMOLOGOUS TEMPERATURES; METAL THIN FILM; METAL THIN FILMS; SINGLE LAYER; SPUTTER-DEPTH PROFILING; STRESS CHANGES; STRESS DEVELOPMENT; STRESS EVOLUTION; STRESS GENERATION; SUB-LAYERS;

COPPER; DEPTH PROFILING; DIFFRACTION; DIFFUSION; ELECTRON SPECTROSCOPY; ISOTHERMAL ANNEALING; METAL ANALYSIS; RESIDUAL STRESSES; SPUTTERING; THERMAL EXPANSION; THERMAL STRESS; THIN FILMS; X RAY DIFFRACTION;

X RAY DIFFRACTION ANALYSIS;

EID: 75749130737 PISSN: 10226680 EISSN: None Source Type: Book Series
DOI: 10.4028/www.scientific.net/AMR.89-91.503 Document Type: Conference Paper

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.