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note
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2 is used to expose the photoresist through a photomask for 30 s. Subsequently, the slide is soaked in MIF-300 developer for 90 s to thoroughly remove unwanted photoresist. The postbake treatment is conducted in an oven at 120 °C for 30 min to stabilize the photoresist. Finally, a wet etching method is used to etch the unwanted gold and titanium, which involves (i) soaking the slide in a 1% (w/w) hydrofluoric acid solution for 4 min, (ii) soaking the slide in a gold etchant GE8148 solution (Transene Inc., MA) for 1 min, and (iii) thoroughly washing away the remaining photoresist using acetone and methanol sequentially and drying in air.
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