Enhanced uniformity in arrays of electroless plated spherical gold nanoparticles using tin presensitization

Langmuir

Volumn 26, Issue 3, 2010, Pages 1533-1538

  Blake, Phillip ^a   Ahn, Wonmi ^b   Roper, D Keith ^a,b  

^a 3202 Bell Engineering Center   (United States)

^b UNIVERSITY OF UTAH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AU PARTICLES; CURE TIME; ELECTROLESS; ELECTROLESS GOLD PLATING; ELECTRON RESIST; GOLD FILM; GOLD NANOPARTICLES; GOLD-NANOPARTICLE ARRAYS; HOLLOW PARTICLE; INTERPARTICLE DISTANCES; NANOCYLINDERS; PATTERNED ELEMENTS; PATTERNED FEATURES; RELATIVE STANDARD DEVIATIONS; RESIST REMOVAL; SIZE AND SHAPE; SPHERICAL NANOPARTICLES; SUBSTRATE SURFACE;

CYLINDERS (SHAPES); ELECTRON BEAM LITHOGRAPHY; ELECTRON BEAMS; ELECTRON EMISSION; ELECTRONS; GOLD; GOLD PLATING; METALLIC FILMS; NANOPARTICLES; SUBSTRATES; TIN; TITANIUM COMPOUNDS;

GOLD COATINGS;

EID: 75749097387     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la903985m     Document Type: Article

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