Microstructural development in a ternary Al-Cu-Si alloy during transient solidification

Materials Science Forum

Volumn 636-637, Issue , 2010, Pages 643-650

  Ferreira, I L ^a   Moutinho, D J ^b   Gomes, L G ^b   Rocha, O L ^b   Goulart, P R ^c   Garcia, A ^c  

^a FLUMINENSE FEDERAL UNIVERSITY   (Brazil)

^b IFPA   (Brazil)

^c UNIVERSITY OF CAMPINAS   (Brazil)

Author keywords

Microstructure; Numerical model; Solidification

Indexed keywords

ALUMINUM ALLOYS; HEAT TRANSFER; MICROSTRUCTURE; NUMERICAL MODELS; SILICON ALLOYS; SOLIDIFICATION; TERNARY ALLOYS;

DENDRITE ARM SPACING; EXPERIMENTAL APPROACHES; MACROSEGREGATIONS; MICROSTRUCTURAL DEVELOPMENT; MICROSTRUCTURAL PARAMETERS; SECONDARY ARM SPACING; THERMAL VARIABLES; UNSTEADY SOLIDIFICATION;

COPPER ALLOYS;

EID: 75649117067     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.636-637.643     Document Type: Conference Paper

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