A new example of the diffusion-limited aggregation: Ni-Cu film patterns

Applied Surface Science

Volumn 256, Issue 9, 2010, Pages 2995-2999

  Kockar, Hakan ^a   Bayirli, Mehmet ^a   Alper, Mursel ^b  

^a BALIKESIR UNIVERSITY   (Turkey)

^b ULUDAG UNIVERSITY   (Turkey)

Author keywords

Electrodepositing; Ferromagnetic thin film growth; Fractal dimension; Monte Carlo Simulations

Indexed keywords

AGGREGATES; BINARY ALLOYS; COPPER ALLOYS; ELECTRODEPOSITION; ELECTRODES; ENERGY DISPERSIVE SPECTROSCOPY; FERROMAGNETIC MATERIALS; FILM GROWTH; FRACTAL DIMENSION; INTELLIGENT SYSTEMS; METALLIC FILMS; MONTE CARLO METHODS; RESPIRATORY MECHANICS; SCANNING ELECTRON MICROSCOPY; THIN FILMS; X RAY DIFFRACTION;

DENSITY-DENSITY CORRELATION FUNCTIONS; DIFFUSION LIMITED AGGREGATION; ELECTRODEPOSITING; ENERGY DISPERSIVE X RAY SPECTROSCOPY; FACE CENTERED CUBIC STRUCTURE; FERROMAGNETIC THIN FILMS; MORPHOLOGICAL OBSERVATIONS; TWO POINT CORRELATION FUNCTIONS;

AGGLOMERATION;

EID: 75249102775     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.11.063     Document Type: Article

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