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Volumn 92, Issue 6, 2010, Pages 1535-1543
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Thermoelasticity analysis of functionally graded beam with integrated surface piezoelectric layers
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Author keywords
Functionally graded material beam; Piezoelectric; State space; Static analysis; Thermoelasticity
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Indexed keywords
ANALYTICAL SOLUTIONS;
APPLIED ELECTRIC FIELD;
BENDING BEHAVIOUR;
BOTTOM SURFACES;
FUNCTIONALLY GRADED;
FUNCTIONALLY GRADED BEAMS;
HYBRID BEAM;
LONGITUDINAL DIRECTION;
NUMERICAL RESULTS;
ORTHOTROPIC MATERIALS;
PIEZOELECTRIC;
PIEZOELECTRIC LAYERS;
PLANE STRESS;
POISSON'S RATIO;
SIMPLY SUPPORTED;
STATE SPACE;
THERMO MECHANICAL LOADS;
THERMO-MECHANICAL;
THICKNESS DIRECTION;
THICKNESS RATIO;
ZERO TEMPERATURES;
BEAMS AND GIRDERS;
CRACK INITIATION;
ELASTICITY;
ELECTRIC FIELDS;
ELECTROMECHANICAL DEVICES;
FOURIER ANALYSIS;
FOURIER SERIES;
FUNCTIONALLY GRADED MATERIALS;
HARMONIC ANALYSIS;
HYBRID MATERIALS;
NUMERICAL ANALYSIS;
PIEZOELECTRICITY;
POISSON RATIO;
STATIC ANALYSIS;
THERMOELASTICITY;
SURFACES;
BENDING PROPERTY;
FOURIER TRANSFORM ANALYSIS;
MECHANICAL PROPERTY;
SENSOR;
STRESS;
TEMPERATURE;
THERMAL PROPERTY;
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EID: 75149152243
PISSN: 02638223
EISSN: None
Source Type: Journal
DOI: 10.1016/j.compstruct.2009.10.030 Document Type: Article |
Times cited : (56)
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References (10)
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