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Volumn , Issue , 2005, Pages 319-324
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Integrated thick-film hybrid microelectronics applied on different material substrates
a
EPFL
(Switzerland)
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Author keywords
Low temperature; Low temperature firing; Sensors; Thick film dielectrics; Thick film resistors
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Indexed keywords
ALUMINA;
ALUMINUM COATED STEEL;
ALUMINUM OXIDE;
CHIP SCALE PACKAGES;
FERRITIC STAINLESS STEEL;
GLASS;
MICROELECTRONICS;
RESISTORS;
SENSORS;
TEMPERATURE;
THICK FILMS;
HIGH POWER ELECTRONICS;
LOW TEMPERATURES;
LOW-TEMPERATURE FIRING;
MATERIAL SUBSTRATES;
THERMAL COEFFICIENT OF EXPANSION;
THERMAL COEFFICIENTS;
THICK FILM RESISTORS;
THICK-FILM MATERIALS;
SUBSTRATES;
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EID: 75049085552
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (5)
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References (8)
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