Thermal interface tailoring in composite materials

Diamond and Related Materials

Volumn 19, Issue 2-3, 2010, Pages 268-272

  Roy, A K ^a   Farmer, B L ^a   Sihn, S ^a,b   Varshney, V ^a,c   Patnaik, S ^a,c   Ganguli, S ^a,b  

^a AIR FORCE RESEARCH LABORATORY   (United States)

^b UNIVERSITY OF DAYTON RESEARCH INSTITUTE   (United States)

^c UNIVERSAL TECHNOLOGY CORPORATION   (United States)

Author keywords

Bonded joints; Composite materials; Multiscale modeling; Thermal interface; Thermal materials

Indexed keywords

BONDED JOINT; BONDED JOINTS; MULTI-SCALE MODELING; THERMAL INTERFACES; THERMAL MATERIALS;

COMPOSITE MATERIALS; COMPOSITE MICROMECHANICS; FUNCTIONAL POLYMERS; HYBRID MATERIALS; MATERIALS PROPERTIES; MOLECULAR DYNAMICS; PHONONS; THERMODYNAMIC PROPERTIES;

SURFACES;

EID: 74849119665     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2009.10.024     Document Type: Article

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