Microstructure and dielectric properties of chopping SiCf/LAS composites

Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering

Volumn 38, Issue 12, 2009, Pages 2089-2092

  Zhai, Xiaoyong ^a   Zhou, Wancheng ^a   Luo, Fa ^a   Zhu, Dongmei ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Chopping SiCf; Dielectric properties; LAS glass ceramic

Indexed keywords

DIELECTRIC CONSTANTS; DIELECTRIC DISSIPATION; FRACTOGRAPHS; FREQUENCY DISPERSION EFFECT; IMAGINARY PARTS; INTERFACIAL FILM; MATRIX; ORDERS OF MAGNITUDE; PRESSING METHODS; PRESSING TIME; REAL PART; SEM;

CERAMIC MATERIALS; COMPOSITE FILMS; DIELECTRIC PROPERTIES OF SOLIDS; GLASS; LITHIUM ALLOYS; MICROSTRUCTURE; PERMITTIVITY; SECONDARY BATTERIES; SILICON CARBIDE;

HOT PRESSING;

EID: 74849095171     PISSN: 1002185X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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