Nanoparticle deposition effects on the minimum heat flux point and quench front speed during quenching in water-based alumina nanofluids

International Journal of Heat and Mass Transfer

Volumn 53, Issue 7-8, 2010, Pages 1542-1553

  Kim, Hyungdae ^a   Buongiorno, Jacopo ^a   Hu, Lin Wen ^a   McKrell, Thomas ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Film boiling; Rodlets; Wettability

Indexed keywords

ALUMINA NANOPARTICLE; FILM BOILING; LIQUID-SOLID INTERACTION; MINIMUM HEAT FLUX; NANOFLUIDS; NANOPARTICLE DEPOSITION; NANOPARTICLE EFFECTS; NANOPARTICLE LAYERS; POINT TEMPERATURE; PURE WATER; QUENCHING PROCESS; SOLID CONTACTS; SURFACE WETTABILITY; WATER BASED;

ATMOSPHERIC PRESSURE; EVAPORATION; HEAT FLUX; LIQUIDS; NANOPARTICLES; QUENCHING;

NANOFLUIDICS;

EID: 74549192205     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2009.11.029     Document Type: Article

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