Carbon nanotubes for nanoscale low temperature flip chip connections

Microelectronic Engineering

Volumn 87, Issue 3, 2010, Pages 438-442

  Hermann, Sascha ^a   Pahl, Barbara ^b   Ecke, Ramona ^c   Schulz, Stefan E ^a,c   Gessner, Thomas ^a,c  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

Author keywords

ALD; CNT bumps; Flip chip bonding; Selective growth

Indexed keywords

BOND PAD; CARBON SOURCE; CHIP ASSEMBLY; CONTACT PADS; ELECTRICAL CHARACTERIZATION; ELECTRICAL CONTACTS; ELECTROLESS; FLIP CHIP BONDING; FLIP-CHIP CONNECTIONS; FLIP-CHIP INTERCONNECTION; FOUR-POINT MEASUREMENTS; GAS COMPOSITIONS; GROWTH PARAMETERS; GROWTH TIME; LAYER STACKS; LIFTOFF TECHNIQUE; LOSSLESS; LOW TEMPERATURES; METAL PAD; METALLIZATION SYSTEMS; METALLIZATIONS; MULTI-WALLED; NANO SCALE; NEW APPROACHES; NICKEL CATALYST; PATTERNED GROWTH; RELIABILITY TEST; SELECTIVE GROWTH; TEST STRUCTURE; THERMAL CVD; TIME STABILITY; ULTRA-FINES;

CATALYSIS; CATALYSTS; CHEMICAL VAPOR DEPOSITION; ELECTRIC CONTACTS; ETHYLENE; FLIP CHIP DEVICES; GROWTH TEMPERATURE; METALLIZING;

CARBON NANOTUBES;

EID: 74449087916     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.05.027     Document Type: Article

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