A novel Interconnected Patch-Ring (IPR) structure for noise isolation

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 2009, Pages 328-333

  Ndip, Ivan ^a   Guttowski, Stephan ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL PERFORMANCE; ELECTROMAGNETIC BANDGAP STRUCTURES; ELECTRONIC PACKAGE; FREQUENCY RANGES; INTEGRATION DENSITY; MICROELECTRONIC PACKAGE; NOISE COUPLING; NOISE ISOLATION; PATTERNED LAYERS; PLACEMENT AND ROUTING; SYSTEM FUNCTIONALITY; TRANSMISSION LINE;

BANDPASS FILTERS; ELECTRIC REACTORS; ELECTROMAGNETISM; ELECTRONIC EQUIPMENT MANUFACTURE; INTERCONNECTION NETWORKS; METAMATERIALS; MICROELECTRONICS; PLASTIC MOLDS;

ELECTROMAGNETIC COMPATIBILITY;

EID: 74349087024     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2009.5284623     Document Type: Conference Paper

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