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Volumn 57, Issue 1, 2010, Pages 345-352

Thermal accumulation effects on the transient temperature responses in LDMOSFETs under the impact of a periodic electromagnetic pulse

Author keywords

Electrostatic discharge (ESD); LDMOSFET; Peak temperature; Periodic electromagnetic pulse (EMP); Thermal accumulation; Time domain finite element method (FEM); Transient thermal response

Indexed keywords

CONJUGATED GRADIENT; LDMOSFET; PEAK TEMPERATURES; PULSEWIDTHS; THERMAL ACCUMULATION; THERMAL ACCUMULATION EFFECTS; TIME-DOMAIN FINITE ELEMENT METHODS; TRANSIENT TEMPERATURE RESPONSE; TRANSIENT THERMAL RESPONSE; WAVE FORMS;

EID: 73349143610     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2009.2034995     Document Type: Article
Times cited : (36)

References (13)
  • 1
    • 0034141004 scopus 로고    scopus 로고
    • A LDMOS technology compatible with CMOS and passive components for integrated RF power amplifiers
    • Feb.
    • Y. Tan, M. Kumar, J. K. O. Sin, J. Cai, and J. Lau, "A LDMOS technology compatible with CMOS and passive components for integrated RF power amplifiers," IEEE Electron Device Lett., vol.21, no.2, pp. 82-84, Feb. 2000.
    • (2000) IEEE Electron Device Lett. , vol.21 , Issue.2 , pp. 82-84
    • Tan, Y.1    Kumar, M.2    Sin, J.K.O.3    Cai, J.4    Lau, J.5
  • 2
    • 0035279648 scopus 로고    scopus 로고
    • An SOI LDMOS/CMOS/BJT technology for integrated power amplifiers used in wireless transceiver applications
    • Mar.
    • M. Kumar, Y. Tan, J. K. O. Sin, and J. Cai, "An SOI LDMOS/CMOS/BJT technology for integrated power amplifiers used in wireless transceiver applications," IEEE Electron Device Lett., vol.22, no.3, pp. 136-138, Mar. 2001.
    • (2001) IEEE Electron Device Lett. , vol.22 , Issue.3 , pp. 136-138
    • Kumar, M.1    Tan, Y.2    Sin, J.K.O.3    Cai, J.4
  • 3
    • 0034297791 scopus 로고    scopus 로고
    • 120 v interdigitated-drain LDMOS (IDLDMOS) on SOI substrate breaking power LDMOS limit
    • Oct.
    • S. M. Xu, K. P. Gan, G. S. Samudra, Y. C. Liang, and J. K. O. Sin, "120 V interdigitated-drain LDMOS (IDLDMOS) on SOI substrate breaking power LDMOS limit," IEEE Trans. Electron Devices, vol.47, no.10, pp. 1980-1985, Oct. 2000.
    • (2000) IEEE Trans. Electron Devices , vol.47 , Issue.10 , pp. 1980-1985
    • Xu, S.M.1    Gan, K.P.2    Samudra, G.S.3    Liang, Y.C.4    Sin, J.K.O.5
  • 4
    • 4444383317 scopus 로고    scopus 로고
    • Introduction to the special issue on high-power electromagnetics (HPEM) and intentional electromagnetic interference (IEMI)
    • Aug.
    • W. A. Radasky, C. E. Baum, and M. W. Wik, "Introduction to the special issue on high-power electromagnetics (HPEM) and intentional electromagnetic interference (IEMI)," IEEE Trans. Electromagn. Compat., vol.46, no.3, pp. 314-321, Aug. 2004.
    • (2004) IEEE Trans. Electromagn. Compat. , vol.46 , Issue.3 , pp. 314-321
    • Radasky, W.A.1    Baum, C.E.2    Wik, M.W.3
  • 7
    • 0032157502 scopus 로고    scopus 로고
    • Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation
    • Sep.
    • S. Rzepka, K. Banerjee, E. Meusel, and C. Hu, "Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation," IEEE Trans. Compon., Packag., Manuf. Technol. A, vol.21, no.3, pp. 406-411, Sep. 1998.
    • (1998) IEEE Trans. Compon., Packag., Manuf. Technol. A , vol.21 , Issue.3 , pp. 406-411
    • Rzepka, S.1    Banerjee, K.2    Meusel, E.3    Hu, C.4
  • 8
    • 33846609148 scopus 로고    scopus 로고
    • Accelerated chip-level thermal analysis using multilayer Green's function
    • Feb.
    • B. H. Wang and P. Mazumder, "Accelerated chip-level thermal analysis using multilayer Green's function," IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., vol.26, no.2, pp. 325-344, Feb. 2007.
    • (2007) IEEE Trans. Comput.-Aided Design Integr. Circuits Syst. , vol.26 , Issue.2 , pp. 325-344
    • Wang, B.H.1    Mazumder, P.2
  • 9
    • 33846639161 scopus 로고    scopus 로고
    • Transient thermal analysis of GaN heterojunction transistors for high-power applications
    • Jan.
    • J. F. Xu, W. Y. Yin, and J. F. Mao, "Transient thermal analysis of GaN heterojunction transistors for high-power applications," IEEE Microw. Wireless Compon. Lett., vol.17, no.1, pp. 55-57, Jan. 2007.
    • (2007) IEEE Microw. Wireless Compon. Lett. , vol.17 , Issue.1 , pp. 55-57
    • Xu, J.F.1    Yin, W.Y.2    Mao, J.F.3
  • 11
    • 85057387419 scopus 로고    scopus 로고
    • M. Golio Ed.. Boca Raton, FL: CRC Press
    • M. Golio, Ed., The RF and Microwave Handbook. Boca Raton, FL: CRC Press, 2001.
    • (2001) The RF and Microwave Handbook
  • 12
    • 33947112793 scopus 로고    scopus 로고
    • New mathematical descriptions of ESD current waveform based on the polynomial of pulse function
    • Aug.
    • Z. Yuan, T. Li, J. He, S. Chen, and R. Zeng, "New mathematical descriptions of ESD current waveform based on the polynomial of pulse function," IEEE Trans. Electromagn. Compat., vol.48, no.3, pp. 589-591, Aug. 2006.
    • (2006) IEEE Trans. Electromagn. Compat. , vol.48 , Issue.3 , pp. 589-591
    • Yuan, Z.1    Li, T.2    He, J.3    Chen, S.4    Zeng, R.5
  • 13
    • 69549120007 scopus 로고    scopus 로고
    • Transient electrothermal analysis of multilevel interconnects in the presence of ESD pulses using the nonlinear time-domain finite element method
    • Y.-B. Shi, W.-Y. Yin, J.-F. Mao, and Q. H. Liu, "Transient electrothermal analysis of multilevel interconnects in the presence of ESD pulses using the nonlinear time-domain finite element method," IEEE Trans. Electromagn. Compat., vol.51, no.3, pp. 774-783, 2009.
    • (2009) IEEE Trans. Electromagn. Compat. , vol.51 , Issue.3 , pp. 774-783
    • Shi, Y.-B.1    Yin, W.-Y.2    Mao, J.-F.3    Liu, Q.H.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.