Challenges for IGBT modules in hybrid buses

2009 13th European Conference on Power Electronics and Applications, EPE '09

Volumn , Issue , 2009, Pages

  Helsper, Martin ^a   Brendel, Bernd ^a  

^a SIEMENS AG   (Germany)

Author keywords

Energy converters for HEV; IGBT; Mission profile; Road vehicle; Thermal stress

Indexed keywords

ENERGY CONVERTERS FOR HEV; HYBRID BUS; HYBRID DRIVE; KNOW-HOW; LEVEL OF INTEREST; MISSION PROFILE; OPERATING CONDITION; ROAD VEHICLES;

AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; IMAGE RECORDING; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); PHOTOLITHOGRAPHY; POWER ELECTRONICS; ROADS AND STREETS; TECHNOLOGY TRANSFER; THERMAL STRESS; THERMOELASTICITY;

ACTIVE FILTERS;

EID: 72949115292     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. H. Keller: Robustness validation - an improved qualification method for semiconductor devices in automotive, CIPS, Nuremberg 2008, Germany
3. nd SiC user forum 2007, Copenhagen, Denmark
4. P. Friedrichs: Compact Power Electronics due to SiC Devices, CIPS 2008. Nuremberg, Germany
5. R. Bayerer: Higher junction temperature in power modules - a demand from hybrid cars, a potential for the next step increase in power density for various variable speed drives, PCIM 2008, Nuremberg, Germany
6. U. Scheuermann: The road to next generation power module - 100% solder free design, CIPS, Nuremberg 2008, Germany
7. R. Amro, J. Lutz, J. Rudzki, M. Thoben, A. Lindemann: Double Sided Low Temperature Joining Technique for Power Cycling Capability at High Temperature, EPE 2005, Dresden, Germany