Dielectric microwave characterization of the SU-8 thick resin used in an above IC process

European Microwave Week 2009, EuMW 2009: Science, Progress and Quality at Radiofrequencies, Conference Proceedings - 39th European Microwave Conference, EuMC 2009

Volumn , Issue , 2009, Pages 1041-1044

  Ghannam, Ayad ^a,b   Viallon, Christophe ^a   Bourrier, David ^a   Parra, Thierry ^a  

^a UNIVERSITÉ DE TOULOUSE   (France)

^b Feescale Semiconductor Inc   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ABOVE IC PROCESS; ANALYTICAL COMPUTATIONS; ANALYTICAL EQUATIONS; CHARACTERIZATION PROCEDURES; ELECTRICAL PROPERTY; HIGH-Q INDUCTORS; LOSS TANGENT; LOW-RESISTIVITY SILICON SUBSTRATE; MICROWAVE CHARACTERIZATION; RELATIVE DIELECTRIC CONSTANT; RELATIVE PERMITTIVITY; S-PARAMETER MEASUREMENTS; THIN-FILM MICROSTRIP TRANSMISSION LINE;

COMPUTATIONAL EFFICIENCY; ELECTRIC PROPERTIES; EQUIVALENT CIRCUITS; MATERIALS PROPERTIES; MICROSTRIP LINES; MICROWAVES; PERMITTIVITY; RESINS; SCATTERING PARAMETERS;

DIELECTRIC MATERIALS;

EID: 72949085566     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2009.5295989     Document Type: Conference Paper

References (9)

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