Defectivity issues in topcoatless photoresists

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 27, Issue 6, 2009, Pages 3014-3019

  Cantone, Jason ^a   Van Dommelen, Youri ^b   Jiang, Aiqin ^b   Dunn, Shannon ^a   Winter, Tom ^c   Petrillo, Karen ^d   Johnson, Rick ^d   Lawson, Peggy ^d   Conley, Will ^e   Callahan, Ryan ^f  

^a TEL TECHNOLOGY CENTER   (United States)

^b ASML US Inc   (United States)

^c TOKYO ELECTRON AMERICA INC   (United States)

^d IBM   (United States)

^e FreeScale   (United States)

^f Fujifilm Electronic Materials USA Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCING CONTACT ANGLE; DEFECTIVITY; IMMERSION LITHOGRAPHY; INDUSTRY STANDARDS; LITHOGRAPHY PROCESS; PATTERN COLLAPSE; PATTERN DEFECTS; PROCESS CONDITION; RECEDING CONTACT; TEMPERATURE OPTIMIZATION; WATER BASED;

ADDITIVES; CONTACT ANGLE; COST REDUCTION; DEFECTS; DISSOLUTION; HYDROPHOBICITY; LEACHING; PHOTORESISTORS; SURFACE DEFECTS; SURFACE PROPERTIES; SURFACE TREATMENT;

LITHOGRAPHY;

EID: 72849137287     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.3253612     Document Type: Conference Paper

References (9)

1. K. Sho et al., Proceeding of the Advances in Resist Materials and Processing Technology XXVI., Session 7273, pp. 4-6 (2009).
2. S. Wu et al., Proc. SPIE 6923, 1 (2008).
3. S. Burns et al., J. Vac. Sci. Technol. B 20, 537 (2002).
4. J. R. Sheats and B. W. Smith, Microlithography: Science and Technology (Dekker, New York, 1998).
5. C. A. Mack, Fundamental Principles of Optical Lithography: The Science of Microfabrication (Wiley, West Sussex, 2007), pp. 205-209.
6. N. Nakano et al., Proc. SPIE 7274, 2 (2009).
7. J. Cantone et al., Proc. SPIE 7273, 3 (2009).
8. T. Naruoka et al., Proceeding of the Advances in Resist Materials and Processing Technology XXVI., Session 7273, pp. 4 (2009).
9. P. Lawson et al., Proceeding of the Advances in Resist Materials and Processing Technology XXVI., Session 7273, pp. 2-4 (2009).