Microstructure and mechanical performance of depositing CuSi3 Cu alloy onto 30CrMnSi steel plate by the novel consumable and non-consumable electrodes indirect arc welding

Materials and Design

Volumn 31, Issue 4, 2010, Pages 2253-2258

  Wang, Jun ^a,b   Cao, Jian ^a   Feng, Jicai ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b JIAMUSI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ARC-WELDING; BASE METALS; CONSUMABLE ELECTRODES; CU ALLOY; DEPOSITED METAL; DILUTION RATIO; FE LAYER; FORMATION MECHANISM; FRACTURE MORPHOLOGY; HEAT INPUT; INTERFACIAL ZONES; MECHANICAL PERFORMANCE; PICKING UP; SEM; SOLID-PHASE; STEEL PLATES; SUB-LAYERS; WELDING TORCH;

CAVITY RESONATORS; COMPRESSIVE STRENGTH; COPPER ALLOYS; DUCTILE FRACTURE; ELECTRIC ARC WELDING; ENERGY DISPERSIVE SPECTROSCOPY; IRON; IRON ALLOYS; METALS; MICROSTRUCTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SILICON; SILICON ALLOYS; WELDING; WELDS;

WELDING ELECTRODES;

EID: 72749085760     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2009.10.011     Document Type: Article

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