The role of solid surface structure on dropwise phase change processes

International Journal of Heat and Mass Transfer

Volumn 53, Issue 5-6, 2010, Pages 910-922

  Ojha, Manas ^a   Chatterjee, Arya ^a   Mont, Frank ^a,b   Schubert, E F ^a,b   Wayner Jr , Peter C ^a   Plawsky, Joel L ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b Rensselaer Polytechnic Institute   (United States)

Author keywords

Condensation; Contact angle; Evaporation; Nanorod; Roughness

Indexed keywords

APPARENT CONTACT ANGLE; CONDENSATION HEAT TRANSFER; ENHANCED PERFORMANCE; EVAPORATIVE HEAT TRANSFER; FLUID SOLID INTERACTION; GLANCING ANGLE DEPOSITION; HEAT TRANSFER RATE; INTERMOLECULAR FORCES; NANO SCALE; PHASE CHANGE; PHASE CHANGE PROCESS; POROUS SURFACE; ROUGH SURFACES; SEM; SMOOTH SURFACE; SOLID SURFACE; SURFACE ALTERATION; WETTING CHARACTERISTICS; WETTING FLUID; WETTING PROPERTY;

ATOMIC FORCE MICROSCOPY; CHEMICAL BONDS; COATINGS; CONDENSATION; CONTACT ANGLE; EVAPORATION; HEAT EXCHANGERS; HEAT TRANSFER; NANORODS; PLASMA DEPOSITION; SCANNING ELECTRON MICROSCOPY; SILICON COMPOUNDS; SURFACE ROUGHNESS; SURFACE STRUCTURE; VAPORS; WETTING;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

EID: 72649087125     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2009.11.033     Document Type: Article

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