Application of two-phase spray cooling for thermal management of electronic devices

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 4, 2009, Pages 784-793

  Visaria, Milan ^a   Mudawar, Issam ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Defense electronics; Phase change cooling; Spray cooling

Indexed keywords

COOLING PERFORMANCE; CRITICAL HEAT FLUX; DEFENSE ELECTRONICS; DROPLET FORMATION; ELECTRONIC DEVICE; HIGH-SPEED VIDEO; LARGE HEAT FLUX; PHASE CHANGE COOLING; PREDICTIVE CAPABILITIES; SPRAY COOLING; SPRAY PERFORMANCE; SUBCOOLING EFFECTS; SUBCOOLINGS; THERMAL MANAGEMENT;

DROP FORMATION; HEAT FLUX; SPRAY STEELMAKING; TABLE LOOKUP; THERMOELECTRIC EQUIPMENT;

COOLING;

EID: 72149101840     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2010405     Document Type: Article

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