Influence of Pd on kinetics of solid-state reactive diffusion between Sn and Ni

Journal of Alloys and Compounds

Volumn 485, Issue 1-2, 2009, Pages 144-149

  Masui, K ^a   Kajihara, M ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Intermetallics; Metals; Surfaces and interfaces

Indexed keywords

ANNEALING TEMPERATURES; ANNEALING TIME; COMPOUND LAYER; DIFFUSION BONDING TECHNIQUE; DIFFUSION COUPLE; ENERGIZATION; GROWTH BEHAVIOR; ISOTHERMALLY ANNEALED; MATRIX; ORDER OF MAGNITUDE; PD ALLOY; REACTIVE DIFFUSION; SOLID-STATE REACTIVE DIFFUSION; SOLID-STATE TEMPERATURES; SURFACES AND INTERFACES; VOLUME DIFFUSION;

ANNEALING; BINARY ALLOYS; DIFFUSION; GROWTH KINETICS; HEATING; INTERMETALLICS; METAL ANALYSIS; MULTILAYERS; NICKEL; PALLADIUM; TIN ALLOYS;

TIN;

EID: 72049128589     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.05.100     Document Type: Article

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