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Volumn 204, Issue 6-7, 2009, Pages 824-828
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Growth of intermetallic layer in the aluminide mild steel during hot-dipping
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Author keywords
EBSD; Hot dipping; Intermetallic layer; Mild steel; Tongue like morphology
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Indexed keywords
ALUMINIDES;
COLUMNAR GRAIN;
COLUMNAR STRUCTURES;
DIFFUSION DIRECTION;
ELECTRON BACK SCATTER DIFFRACTION;
FINE GRAINS;
GROWTH BEHAVIOR;
GROWTH OF INTERMETALLICS;
HOT-DIPPING;
INTERMETALLIC LAYER;
MILD STEEL;
MOLTEN ALUMINUM;
RAPID RATE;
STEEL SUBSTRATE;
SUBSTRATE INTERFACE;
ALUMINUM;
ALUMINUM COATED STEEL;
CARBON STEEL;
ELECTRON DIFFRACTION;
IRON COMPOUNDS;
MORPHOLOGY;
PHASE INTERFACES;
SUBSTRATES;
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EID: 71849119802
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/j.surfcoat.2009.09.061 Document Type: Article |
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Times cited : (168)
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References (17)
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