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Volumn 249, Issue 3, 2009, Pages 991-995
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The chemical bonding of copper ions on kaolin from Suzhou, China
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Author keywords
Adsorption isotherms; Copper ions; Desorption; Kaolin
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Indexed keywords
ADSORPTION CHARACTERISTIC;
ADSORPTION MAXIMA;
CHEMICAL BONDINGS;
COPPER IONS;
CORRELATION COEFFICIENT;
CU ADSORPTION;
LANGMUIR AND FREUNDLICH ADSORPTION;
LANGMUIR EQUATION;
LINEAR MODEL;
NONSPECIFIC ADSORPTION;
PH CONDITION;
PH VALUE;
ADSORPTION;
ADSORPTION ISOTHERMS;
ATMOSPHERIC TEMPERATURE;
CHEMICAL BONDS;
CONCENTRATION (PROCESS);
COPPER;
DESORPTION;
DYES;
METAL IONS;
PH;
KAOLIN;
ADSORPTION;
CHEMICAL BONDING;
CONCENTRATION (COMPOSITION);
COPPER;
DESORPTION;
ION;
KAOLIN;
PH;
SOLUTION;
ASIA;
CHINA;
EURASIA;
FAR EAST;
JIANGSU;
SUZHOU;
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EID: 71649102439
PISSN: 00119164
EISSN: None
Source Type: Journal
DOI: 10.1016/j.desal.2009.09.017 Document Type: Article |
Times cited : (37)
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References (9)
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