Shelf stability of reactive adhesive formulations: A case study for dicyandiamide-cured epoxy systems

International Journal of Adhesion and Adhesives

Volumn 30, Issue 2, 2010, Pages 105-110

  Raetzke, K ^a   Shaikh, M Q ^a   Faupel, F ^a   Noeske, P L M ^b  

^a UNIVERSITY OF KIEL   (Germany)

^b FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

Author keywords

Aging; Cure hardening; Epoxy epoxides; Johnson Mehl Avrami Kolmogorov; Positron annihilation lifetime

Indexed keywords

ADHESIVE FORMULATION; CURE/HARDENING; CURED EPOXY; CURING BEHAVIOR; DICYANDIAMIDE; EPOXY/EPOXIDES; GROWTH EXPONENT; ISOTHERMAL MEASUREMENTS; JOHNSON-MEHL-AVRAMI-KOLMOGOROV; JOHNSON-MEHL-AVRAMI-KOLMOGOROV APPROACHES; O-PS LIFETIME; POSITRON ANNIHILATION LIFETIME SPECTROSCOPY; POSITRON ANNIHILATION LIFETIMES; REACTION CONSTANT; ROOM TEMPERATURE; SHELF LIFE; SHELF STABILITY;

APPROXIMATION THEORY; COAGULATION; COMPUTATIONAL COMPLEXITY; CURING; GELATION; POSITRON ANNIHILATION; POSITRON ANNIHILATION SPECTROSCOPY; RESINS;

EPOXY RESINS;

EID: 71649085433     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2009.09.004     Document Type: Article

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