Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation

Procedia Chemistry

Volumn 1, Issue 1, 2009, Pages 76-79

  Hansen, U ^a   Maus, S ^a   Leib, J ^a   Topper M ^b  

^a MSG Lithoglas AG   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

borosilicate glass; e beam; evaporation; hermetic; optical coating; wafer level packaging

Indexed keywords

COST-EFFICIENT; E BEAM EVAPORATION; E-BEAM; FILM PROPERTIES; HERMETIC; INERT MATERIALS; MATERIAL PROPERTY; MOISTURE ABSORPTION; TEMPERATURE STABILITY; WAFER LEVEL PACKAGING;

ELECTRONICS PACKAGING; EVAPORATION; OPTICAL COATINGS; OPTICAL MATERIALS; OPTICAL PROPERTIES; PLASMA STABILITY; VAPORS;

BOROSILICATE GLASS;

EID: 71549130418     PISSN: 18766196     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1016/j.proche.2009.07.019     Document Type: Conference Paper

References (4)

1. Lau J.H. Chip on Board Technologies for Multichip Modules (1994), Springer
2. Licari J.J. Coating Materials for Electronic Applications (2003), Noyes Publications, New York 1-63
3. Biernacki J.J., Kannan P., Meyer H., and Blue C. Kinetics of borosilicate glass deposition. J. Mater. Res. Vol 19 Iss. 3 (2004) 872-879
4. Maus S., Hansen U., Leib J., and Töpper M. A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level. Proceedings of the Eurosensors XXIII conference, Lausanne, Sept. (2009)