Full wafer integration of shape memory alloy microactuators using adhesive bonding

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2009, Pages 845-848

  Sandstrom N ^a   Braun, S ^a   Stemme, G ^a   Van Der Wijngaart, W ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Adhesive bonding; MEMS; Microactuator; Microelectromechanical systems; Shape memory alloy; SMA; Titanium Nickel; Wafer scale integration

Indexed keywords

ADHESIVE BONDING; MICRO ELECTRO MECHANICAL SYSTEM; SHAPE MEMORY ALLOY; TITANIUM-NICKEL; WAFER-SCALE INTEGRATION;

COMPOSITE MICROMECHANICS; INTEGRATION; MECHATRONICS; MEMS; MICROACTUATORS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; NANOCANTILEVERS; NICKEL ALLOYS; PAPER SHEETING; PIEZOELECTRIC TRANSDUCERS; SEMICONDUCTING SILICON COMPOUNDS; SHAPE MEMORY EFFECT; SILICON ALLOYS; SILICON WAFERS; SOLID-STATE SENSORS; TITANIUM; TITANIUM ALLOYS;

WAFER BONDING;

EID: 71449125315     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285794     Document Type: Conference Paper

References (9)

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