|
|
Volumn , Issue , 2008, Pages 394-398
|
|
Failure mode and effects analysis of a process of reflow lead-free soldering
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
CORRECTIVE ACTIONS;
CRITICAL FAILURES;
DIAGNOSTIC METHODS;
FAILURE MODE AND EFFECTS ANALYSIS;
FLOW CHARTS;
LEAD-FREE SOLDERING;
PRODUCTION PROCESS;
DECISION MAKING;
DECISION THEORY;
FLIP CHIP DEVICES;
GRAPHIC METHODS;
LEAD;
OPTIMIZATION;
QUALITY ASSURANCE;
SAFETY FACTOR;
SOLDERING;
FAILURE ANALYSIS;
|
|
EID: 71249154459
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISSE.2008.5276636 Document Type: Conference Paper |
|
Times cited : (1)
|
|
References (4)
|
