Nano-clay and micro-silica mixed composites for insulating materials for environmentally-conscious switchgear

Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials

Volumn , Issue , 2009, Pages 864-867

  Ozaki, Tamon ^a   Komiya, Gen ^a   Murayama, Kiyoko ^a   Imai, Takahiro ^a   Sawa, Fumio ^a   Shimizu, Toshio ^a   Harada, Miyuki ^b   Ochi, Mitsukazu ^b   Ohki, Yoshimichi ^c   Tanaka, Toshikatsu ^c  

^a TOSHIBA CORPORATION   (Japan)

^b KANSAI UNIVERSITY   (Japan)

^c WASEDA UNIVERSITY   (Japan)

Author keywords

Insulation breakdown; Nanocomposite; Reaction kinetics; Rheological characteristics; Simulation

Indexed keywords

CURING REACTIONS; HOMOGENEOUS ELECTRIC FIELD; INSULATION BREAKDOWN; MATERIAL CHARACTERISTICS; NANO CLAYS; PRACTICAL USE; PRESSURE GELATION; RHEOLOGICAL BEHAVIORS; RHEOLOGICAL CHARACTERISTICS; SIMULATION; SWITCH GEARS;

ASSOCIATION REACTIONS; BUILDING MATERIALS; CLAY MINERALS; COAGULATION; ELECTRIC FIELDS; ELECTRIC INSULATION; ELECTRIC PROPERTIES; FREE RADICAL POLYMERIZATION; GELATION; INSULATING MATERIALS; NANOCOMPOSITES; REACTION KINETICS; RHEOLOGY; SILICA;

DIELECTRIC MATERIALS;

EID: 71049150914     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICPADM.2009.5252223     Document Type: Conference Paper

References (3)

1. T. Imai, "Nanocomposite insulating materials for environmentally- Conscious heavy electric apparatuses."Toshiba Review, Vol.61, No.12, pp.60-61 (2006). (in Japanese).
2. T. Imai, G. Komiya, K. Murayama, T. Ozaki, F. Sawa, T. Shimizu, M. Harada, M. Ochi, Y. Ohki and T. Tanaka: "Improving Epoxy-based Insulating Materials with Nano-fillers toward Practical Application", Proceeding of IEEE International Symposium on Electrical Insulation (ISEI), pp.201-204 (2008).
3. M. Harada, T. Miyamoto, M. Ochi, "Dispersibility and mechanical properties of epoxy/clay nanocomposites prepared by different clay treatment methods", Proceedings of the 10th Pacific Polymer Conference (PPC10), p.240 (2007).