3D Si-level integration in wireless sensor node

Smart Systems Integration 2009, SSI 2009

Volumn , Issue , 2009, Pages 150-157

  Van Engen, Piet ^a   Van Doremalen, Ric ^a   Jochems, Wouter ^a   Rommers, Ad ^a   Cheng, Shi ^b   Rydberg, Anders ^b   Fritzsch, Thomas ^c   Wolf, Jürgen ^c   De Raedt, Walter ^d   Müller, Philippe ^d   Alarcon, Eduardo ^a   Sanduleanu, Mihai ^a,e  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b UPPSALA UNIVERSITY   (Sweden)

^c FRAUNHOFER IZM   (Germany)

^d IMEC   (Belgium)

^e IBM T J WATSON RESEARCH CENTER   (United States)

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EID: 70549101071     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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