3D IC pixel electronics-the next challenge

Proceedings of the Topical Workshop on Electronics for Particle Physics, TWEPP 2008

Volumn , Issue , 2008, Pages 183-187

  Yarema, R ^a   Christian, D ^b   Demarteau, M ^b   Deptuch, G ^b   Hoff, J ^b   Lipton, R ^b   Shenai, A ^b   Trimpl, M ^b   Zimmerman, T ^b  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; 3-D INTEGRATED CIRCUIT; 3-D INTEGRATED CIRCUIT DESIGNS; CONTINUING DEVELOPMENT; HIGH-PERFORMANCE INTEGRATED CIRCUITS;

HIGH ENERGY PHYSICS; INTEGRATED CIRCUITS;

THREE DIMENSIONAL;

EID: 70549091091     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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2. B. Aull, et al., "Laser Radar Imager Based on 3D Integration of Geiger Mode Avalanche Photodiodes with Two Timing Circuit Layers,", ISSCC, 2006, pp. 26-27.
3. D. Temple, et al., "3-D Integration Technology Platform for High Performance Detector Arrays,", public release from RTI International and DRS Technologies.
4. th International Workshop on Vertex Detectors, PoS (Vertex 2007) 017. http://pos.sissa.it.
5. A. Huffman, "Fabrication, Assembly, and Evaluation of Cu-Cu Bump Bond Arrays for Utra-fine Pitch Hybridization and 3D Assembly,", Pixel 2008, September 22-26, 2008, Fermilab, Batavia IL.
6. th LHC Electronics Workshop, Sept. 25-29, 2006, Valencia, Spain.
7. G. Traversi, et al., "Characterization of Deep N-well CMOS MAPS with in Pixel Signal Processing and Data Sparsification Capabilities for the ILC Vertex Detector,", Vertex 2007, Sept. 23-28, 2007.
8. G. Deptuch, "Vertical Integration of Integrated Circuits and Pixel Detectors, Vertex 2008, Jul 28-Aug. 1, 2008, Uto Island, Sweden.
9. B. Patti, "3D Scaling to Production,", 3D Architecture for Semiconductor Integration and Packaging, Oct. 31, 2006.