Integration of direct-write (DW) and ultrasonic consolidation (UC) technologies to create advanced structures with embedded electrical circuitry

17th Solid Freeform Fabrication Symposium, SFF 2006

Volumn , Issue , 2006, Pages 60-69

  Robinson, Christopher J ^a   Stucker, Brent ^a   Lopes, Amit J ^b   Wicker, Ryan ^b   Palmer, Jeremy A ^c  

^a UTAH STATE UNIVERSITY   (United States)

^b UNIVERSITY OF TEXAS AT EL PASO   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA ARRAYS;

ADVANCED STRUCTURE; COMPLEX ELECTRONIC SYSTEMS; DIRECT WRITE; ELECTRONIC CIRCUITRY; SOLID METALS; TRADITIONAL MANUFACTURING; ULTRASONIC CONSOLIDATION;

ULTRASONICS;

EID: 70450023230     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Church, K.H., Fore, C., and Feeley, T., "Commercial Applications and Review for Direct Write Technologies, " Materials Development for Direct Write Technologies, San Francisco, CA, April 24-26, vol. 624, pp. 3-8, 2000.
2. F.R. Medina, A. Lopes, A. Inamdar, R. Hennessey, J. Palmer, B. Chavez, D. Davis, P. Gallegos, and R. Wicker (2005), "Hybrid Manufacturing: Integrating Direct Write and Stereolithography, " Solid Freeform Fabrication Symposium Proceedings, Austin, TX, August, 2005.
3. G.D. Janaki Ram, Y. Yang, J. George, C. Robinson and B.E. Stucker (2006), "Improving Linear Weld Density in Ultrasonically Consolidated Parts, " Solid Freeform Fabrication Symposium Proceedings, Austin, TX, August, 2006.
4. Solidica (2006) http://solidica.com.