Stacking of full rebuilt wafers for SiP and abandoned sensors/applications

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Val, Christian ^a   Couderc, Pascal ^a   Lartigues, Pierre ^a  

^a 3D PLUS ^*  (France)

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EID: 70449899958     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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