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Volumn , Issue , 2009, Pages
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Packaging of silicon photonic devices: Grating structures for high efficiency coupling and a solution for standard integration
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Author keywords
Fiber coupling; Grating couplers; Packaging; Silicon photonics; Silicon on insulator technology
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Indexed keywords
ALIGNMENT TOLERANCE;
BUTTERFLY PACKAGES;
COUPLING EFFICIENCY;
DESIGN CONCEPT;
EXPERIMENTAL MEASUREMENTS;
FIBER ALIGNMENT;
FIBER COUPLINGS;
FIBER POSITION;
GRATING COUPLERS;
GRATING STRUCTURES;
HIGH EFFICIENCY;
HIGH-PERFORMANCE FIBERS;
MULTIFIBERS;
SILICON PHOTONIC DEVICES;
SILICON PHOTONICS;
SINGLE MODE;
SOI WAVEGUIDES;
STANDARD FIBERS;
STANDARD SINGLE MODE FIBERS;
TILT ANGLE;
VERTICAL COUPLING;
WAFER SCALE;
ALIGNMENT;
FIBERS;
FITS AND TOLERANCES;
MICROELECTRONICS;
MICROSENSORS;
PACKAGING;
PHOTONIC DEVICES;
SILICON WAFERS;
STANDARDS;
SILICON ON INSULATOR TECHNOLOGY;
COUPLING AGENTS;
FIBER OPTICS;
OPTICAL INSTRUMENTS;
PACKAGING;
SEMICONDUCTORS;
SENSORS;
SILICON;
STANDARDS;
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EID: 70449839124
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (6)
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