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Volumn 5, Issue , 2009, Pages 3070-3074
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Dual-cure low-temperature and electron beam-curable resins for wood composites
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Author keywords
Dual cure adhesive; Electron beam; Wood
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Indexed keywords
ADHESIVE FORMULATION;
ADHESIVE SYSTEMS;
CU-RE SYSTEM;
CURABLE RESINS;
DUAL-CURE;
DUAL-CURE ADHESIVE;
DYNAMIC MECHANICAL PROPERTY;
E-BEAM CURING;
LOW TEMPERATURES;
SERVICE TEMPERATURE;
THERMOPLASTIC BEHAVIOR;
WOOD COMPOSITES;
CURING;
DIELECTRIC SPECTROSCOPY;
DYNAMIC ANALYSIS;
ELASTOMERS;
ELECTRON BEAMS;
INFRARED SPECTROSCOPY;
MECHANICAL PROPERTIES;
PLASTIC PRODUCTS;
PLASTICITY;
RESINS;
WOOD;
DYNAMIC MECHANICAL ANALYSIS;
ADHESIVES;
COOLING;
CURING;
ELASTOMERS;
ELECTRON BEAMS;
INFRARED SPECTROSCOPY;
MECHANICAL PROPERTIES;
PLASTICITY;
SYNTHETIC POLYMERS;
WOOD;
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EID: 70449837195
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (5)
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