Evaluation of printed electronics manufacturing line with sensor platform application

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Halonen, Eerik ^a   Kaija, Kimmo ^a   Mäntysalo, Matti ^a   Kemppainen, Antti ^b   Österbacka, Ronald ^c   Björklund, Niklas ^c  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^c ÅBO AKADEMI UNIVERSITY   (Finland)

Author keywords

Electrical interconnection; Electronics manufacturing; Printed electronics; Technology integration

Indexed keywords

ELECTRICAL INTERCONNECTIONS; ELECTRICAL PERFORMANCE; ELECTRONICS MANUFACTURING; FLEXOGRAPHY; HIGH THROUGHPUT; HYBRID PRODUCTION; INK-JET PRINTING; LAND PATTERNS; M-LINES; MANUFACTURING METHODS; MANUFACTURING PROCESS; MATERIAL CONSUMPTION; OPTIMAL PROCESS; ORGANIC TRANSISTOR; PRINTED ELECTRONICS; PRINTED ELECTRONICS TECHNOLOGIES; PRINTING METHOD; PRINTING PROCESS; PRINTING TECHNIQUES; PRODUCTION LINE; SEMICONDUCTIVE; SENSOR APPLICATIONS; SENSOR PLATFORM;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; INK; INTERCONNECTION NETWORKS; MANUFACTURE; MICROELECTRONICS; PRINTING; SENSORS; SURFACE ROUGHNESS; THROUGHPUT;

GRAPHIC METHODS;

EID: 70449787296     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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