Thermal behaviour of epoxy resin filled with high thermal conductivity nanopowders

2009 IEEE Electrical Insulation Conference, EIC 2009

Volumn , Issue , 2009, Pages 524-528

  Kochetov, R ^a   Andritsch, T ^a   Lafont, U ^a   Morshuis, P H F ^a   Picken, S J ^a   Smit, J J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BISPHENOL A; ELECTRICAL POWER EQUIPMENT; EPOXY COMPOSITE; EXPERIMENTAL DATA; HIGH THERMAL CONDUCTIVITY; HOST MATERIALS; INORGANIC FILLERS; INSULATING PROPERTIES; LOW THERMAL CONDUCTIVITY; MORPHOLOGICAL CHARACTERIZATION; NANO POWDERS; NANO-SIZED; PARTICLES SIZES; TEM; THERMAL BEHAVIOURS; THERMOSETTING POLYMERS; TWO PHASE SYSTEMS;

ALUMINUM NITRIDE; BORON; BORON NITRIDE; CARBON FIBER REINFORCED PLASTICS; EPOXY RESINS; FILLERS; INSULATION; NANOSTRUCTURED MATERIALS; NITRIDES; PHENOLS; RESINS; THERMAL CONDUCTIVITY; THERMOANALYSIS; THERMOSETS; TRANSMISSION ELECTRON MICROSCOPY;

CONDUCTING POLYMERS;

EID: 70449659468     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EIC.2009.5166402     Document Type: Conference Paper

References (11)

1. S.L. Shindé, J.S. Goela, High thermal conductivity materials, Springer, 2006.
2. E.P. Plueddemann, Silane coupling agents, Plenum press, 1982.
3. S.M. Olhero, S. Novak, M. Oliveira, K. Krnel, T. Kosmac, J.M.F. Ferreira, "A thermo-chemical surface treatment of AlN powder for the aqueous processing of AlN ceramics", J. Mater. Res., Vol. 19, No3, pp. 746-751, 2004.
4. F. Li, D. Zhang, "Nickel coating on hexagonal boron nitride particles by chemical plating", Metallurgical and Materials Transactions B, Vol. 38B, pp. 149-157, 2007.
5. D. Hotza, O. Sahling, G. Greil, "Hydrophobing of aluminium nitride powders", Journal of Material Science, No30, pp. 127-132, 1995.
6. H.Y. Ng, X. Lu, S.K. Lau, "Thermal conductivity of boron nitride - filled thermoplastics: effect of filler characteristics and composite processing conditions", Polymer Composites, pp. 778-790, 2005.
7. T. Lewis, L. Nielsen, "Dynamic mechanical properties of particulate-filled polymers", Journal of Applied Polymer Science, No14(6), pp. 1449-1471, 1970.
8. rd edition, Dover Inc., New York, NY, 1954.
9. Y. Agari, T. Uno, "Estimation on thermal conductivities of filled polymers", Journal of Applied Polymer Science, No32(7), pp. 5705-5712, 1986.
10. D. Kumlutas, I.H. Tavman, "A numerical and experimental study on thermal conductivity of particle filled polymer composites". Journal of Thermoplastic Composite Materials, No19, pp. 441-455, 2006.
11. Z. Han; J.W. Wood; H. Herman; C. Zhang; G.C. Stevens, "Thermal properties of composites filled with different fillers", International Symposium on Electrical Insulation, pp. 497-501, 2008.