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Volumn 94, Issue 1, 2010, Pages 51-56

High throughput via-metallization technique for multi-crystalline metal wrap through (MWT) silicon solar cells exceeding 16% efficiency

Author keywords

Anti reflection coating; Back contact; Metal wrap through; Multi crystalline; Screen printing; Via

Indexed keywords

BACK CONTACT; CELL EFFICIENCY; CRYSTALLINE METALS; EFFICIENCY GAIN; FAST TRANSFER; HIGH THROUGHPUT; HIGHER EFFICIENCY; LINE PROCESS; METALLIZATION TECHNIQUES; METALLIZATIONS; MULTI-CRYSTALLINE; MULTI-CRYSTALLINE SILICON; PROCESS STEPS; SCREEN-PRINTING PROCESS; VIA;

EID: 70449529659     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2009.06.020     Document Type: Article
Times cited : (25)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.