Effective thermal emission on TFT-LCD TV panels for improving image quality

Advances in Engineering Software

Volumn 41, Issue 2, 2010, Pages 130-140

  Chu, Chung Yi ^a   Pan, Min Chun ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Numerical simulation; Temperature measurement; TFT LCD TV

Indexed keywords

COMPUTER SIMULATION; GLASS INDUSTRY; IMAGE QUALITY; LIQUID CRYSTAL DISPLAYS; LIQUID CRYSTALS; TEMPERATURE DISTRIBUTION; TEMPERATURE MEASUREMENT; THIN FILM TRANSISTORS;

BACKLIGHT UNITS; EXPERIMENTAL DATA; HEAT DISSIPATION; NORMAL OPERATIONS; NUMERICAL MODELING; NUMERICAL SIMULATION; SIMULATION RESULT; TEMPERATURE INCREASE; TFT-LCD TV; TFT-LCDS; THERMAL EMISSIONS; THERMAL FEATURES; THERMAL PHENOMENA; TV PANELS;

MATHEMATICAL MODELS;

EID: 70449518962     PISSN: 09659978     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.advengsoft.2009.09.013     Document Type: Article

References (16)

1. Chen YK, Huang KF, Lin MH. Thermal enhancement of LCD module by numerical analysis. In: Society for information display 2006 international symposium; 2006. p. 524-7.
2. Lee Ch-L, Chen R-Sh. The analysis of heat transfer for 19′′ LCD monitor by CFDesign. In: Proceedings of the 13th national conference on computational fluid dynamics; 2006. CFD13-2201.
3. Chu Ch-Y, Pan M-Ch, Ho J. Thermal analysis and experimental validation on TFT-LCD panels for image quality concerns. In: Proceedings of IEEE the 7th electronics packaging technology conference; 2005. p. 543-8.
4. Chu Ch-Y, Pan M-Ch. Fluid-solid coupling/thermal deformation analysis and experimental validation of on TFT-LCD TV panels. In: Taiwan ANSYS 2005 user conference; 2005. p. 1-59-67.
5. Chu Ch-Y, Pan M-Ch. Transient analysis and experimental validation of thermal-fluidic fields on TFT-LCD TV panels. In: Proceedings of IEEE the 8th electronics packaging technology conference; 2006. p. 346-52.
6. Chu Ch-Y, Pan M-Ch. Transient simulation and experimental validation of thermal-fluidic fields on direct-lit backlight unit. In: Taiwan ANSYS 2006 user conference; 2006. p. 101-7.
7. Lee T.Y.T., Chambers B., and Mahalingam M. Application of CFD technology to electronic thermal management. IEEE Trans Compon Packaging Manuf Technol Part B Adv Packaging 18 3 (1995) 511-520
8. Lee T.Y.T. An investigation of thermal enhancement on flip chip plastic BGA packages using CFD tool. IEEE Trans Compon Packaging Technol 23 3 (2000) 481-489
9. Altaç Z., and Kurtul O. Natural convection in tilted rectangular enclosures with a vertically situated hot plate inside. Appl Therm Eng 27 11-12 (2007) 1832-1840
10. Kim B.S., Lee D.S., Ha M.Y., and Yoon H.S. A numerical study of natural convection in a square enclosure with a circular cylinder at different vertical locations. Int J Heat Mass Transfer 51 7-8 (2008) 1888-1906
11. Ou CR, Her R, Tzeng R, Chen CH, Lin CY. Simulate the mura phenomena caused by the thermal deformation of film materials in the LCD module. In: Proceedings of the 12th international display workshops in conjunction with Asia display; 2005. p. 319-22.
12. Kim G.H., Kim W.-J., Kim S.-M., and Son J.-G. Analysis of thermo-physical and optical properties of a diffuser using PET/PC/PBT copolymer in LCD backlight units. Displays 26 1 (2005) 37-43
13. Kim G.H. A PMMA composite as an optical diffuser in a liquid crystal display backlighting unit. Eur Polym J 41 8 (2005) 1729-1737
14. Chen YS, Hsu CM, Chiu PL, Li YW, Hung TH. Effects of the light guide plate deformation on the optical performance of the LCD module. In: The 31st national conference on theoretical and applied mechanics; 2007. No. F14.
15. ANSYS-CFX Solver, release 10.0: theory, ANSYS Inc; 2006.
16. Incropera F.P., and DeWitt D.P. Fundamentals of heat and mass transfer. 4th ed. (1996), John Wiley & Sons