Influence of solvents on the MWCNT/adhesive grade epoxy nanocomposites preparation

Journal of Reinforced Plastics and Composites

Volumn 28, Issue 22, 2009, Pages 2805-2812

  Sharma, S C ^a   Sheshadri, T S ^a   Krishna, M ^b   Murthy, H N Narasimha ^b   Jose, Jeena ^b  

^a INDIAN INSTITUTE OF SCIENCE   (India)

^b R V COLLEGE OF ENGINEERING   (India)

Author keywords

DMF; Electrical properties.; MWCNT; NMP; Structural adhesive

Indexed keywords

DMF; ELECTRICAL PROPERTIES.; MWCNT; NMP; STRUCTURAL ADHESIVE;

AGGLOMERATION; AMIDES; DISPERSION (WAVES); DISPERSIONS; ELECTRIC CONDUCTIVITY OF SOLIDS; GLASS; GLASS TRANSITION; MECHANICAL PROPERTIES; MULTIWALLED CARBON NANOTUBES (MWCN); NANOCOMPOSITES; ORGANIC SOLVENTS; RESINS; SOLVENTS;

ELECTRIC PROPERTIES;

EID: 70449511143     PISSN: 07316844     EISSN: 15307964     Source Type: Journal    
DOI: 10.1177/0731684408093977     Document Type: Article

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